DescriptionLamination Thickness : 0.8 to 1.6mm
Copper Thickness : 0.5 oz, 1.0 oz and 2.0 oz
Minimum Hole Size : 0.80mm by Punching, 0.6mm by Drilling
Imaging : Silk-screen
Minimum line width : 0.2/0.25mm
Plating : Nickel, Flash Gold, Bondable Gold, Gold Fingers, Tin (hot air levelling / roll-tin)
Solder Mask : UV and Thermo Curable
Options : Carbon Print (info.), Silver Print, Blue Peelable Mask, Silver Through Hole, Carbon Through Hole, V-cut, Plated Through Hole
Electrical Tests : Available
Outgoing Quality Checks : AQL 0.40 Major 1.5 Minor
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